Thermal and mechanical properties of sintered Ag layers for power module...
Microelectronics International, Volume 32, Issue 1, Page 37-42, January 2015. Purpose – The purpose of our paper is to investigate thermal and mechanical properties of Ag sintered layers used for...
View ArticleEffect of wire diameter and hook location on second bond failure modes
Microelectronics International, Volume 32, Issue 1, Page 32-36, January 2015. Purpose – This paper aims to analyze the effect of Au wire size and location of hook during wire pulling test to identify...
View ArticleElectric, magnetic and high frequency properties of screen printed...
Microelectronics International, Volume 32, Issue 1, Page 25-31, January 2015. Purpose – The purpose of this article is to study the effect of ferrite content on electric, magnetic and microwave...
View ArticleMicrofabrication of Si3N4-polyimide membrane for thermo-pneumatic actuator
Microelectronics International, Volume 32, Issue 1, Page 18-24, January 2015. Purpose – The purpose of this paper is to discuss the fabrication technology and test of thermo-pneumatic actuator...
View ArticleIntegrated hygro-swelling and thermo-mechanical behavior of mold compound for...
Microelectronics International, Volume 32, Issue 1, Page 8-17, January 2015. Purpose – The purpose of this paper was to study the combined effect of hygro and thermo-mechanical behavior on a plastic...
View ArticleSelective metallization of solar cells
Microelectronics International, Volume 32, Issue 1, Page 1-7, January 2015. Purpose – This paper aims to present the possibility of the technology of chemical metallization for the production of...
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