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Channel: Emerald Group Publishing Limited: Microelectronics International: An International Journal: Table of Contents
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Thermal and mechanical properties of sintered Ag layers for power module...

Microelectronics International, Volume 32, Issue 1, Page 37-42, January 2015. Purpose – The purpose of our paper is to investigate thermal and mechanical properties of Ag sintered layers used for...

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Effect of wire diameter and hook location on second bond failure modes

Microelectronics International, Volume 32, Issue 1, Page 32-36, January 2015. Purpose – This paper aims to analyze the effect of Au wire size and location of hook during wire pulling test to identify...

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Electric, magnetic and high frequency properties of screen printed...

Microelectronics International, Volume 32, Issue 1, Page 25-31, January 2015. Purpose – The purpose of this article is to study the effect of ferrite content on electric, magnetic and microwave...

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Microfabrication of Si3N4-polyimide membrane for thermo-pneumatic actuator

Microelectronics International, Volume 32, Issue 1, Page 18-24, January 2015. Purpose – The purpose of this paper is to discuss the fabrication technology and test of thermo-pneumatic actuator...

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Integrated hygro-swelling and thermo-mechanical behavior of mold compound for...

Microelectronics International, Volume 32, Issue 1, Page 8-17, January 2015. Purpose – The purpose of this paper was to study the combined effect of hygro and thermo-mechanical behavior on a plastic...

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Selective metallization of solar cells

Microelectronics International, Volume 32, Issue 1, Page 1-7, January 2015. Purpose – This paper aims to present the possibility of the technology of chemical metallization for the production of...

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